Alloys and Composites of Polybenzoxazines by Sarawut Rimdusit Chanchira Jubsilp & Sunan Tiptipakorn

Author:Sarawut Rimdusit, Chanchira Jubsilp & Sunan Tiptipakorn
Language: eng
Format: epub
Publisher: Springer Singapore, Singapore

4.3 Conclusions

The thermal conductivity of boron nitride-filled polybenzoxazine exhibited a very high conductivity value. The remarkably high value was obtained using the well-recognized concept of thermal management in composite materials by maximizing the formation of conductive networks while minimizing the thermal barrier resistance along the heat-flow path. The concept was accomplished by using highly thermally conductive filler with a matrix resin which has low melt viscosity and good adhesion to the filler. In addition, a large particle size with multimodal particle size distribution was used. Boron nitride and polybenzoxazine have properties that meet all these requirements and thus exhibit a very high thermal conductivity value. This molding compound also exhibits high and stable mechanical strength up to 200 °C with a high T g value of ca. 220 °C. Water absorption at room temperature for 24 h of this composite is very low. Boron nitride-filled polybenzoxazine has many outstanding properties which makes it suitable for an application as a molding compound for the electronic packaging industry and other applications with high thermal conductivity.

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